微电子专业英语 本书特色

《微电子专业英语》是高职高专“十二五”电子信息类专业规划教材(微电子技术专业)。

微电子专业英语 目录

前言Chapter I HistoryUnit 1A．TextThe First Transistor inFairchildB．ReadingThe Planar TransistorC．Extracurricular Knowledge The Development ofFairchild Unit 2A．TextThe History of Logic CircuitB．ReadingThe Challenge of FairchildC．Extracurricular KnowledgeThe Management of FairchildUnit 3 A．TextThe Achievement of WanlassB．ReadingWanlass and MooreC．Extracurricular KnowledgeThe Thermal Oxides of MOSTransistors Chapter Ⅱ ChipUnit 1 A．TextLM74 1 Operational AmplifierB．ReadingBeginners and BystandersArticleC．Extracurricular Knowledge1941：First(Vacuum Tube)Op-amp1947：First Op-amp with anExplicit Non-inverting Input1 948：First Chopper-stabilizedOp-ampUnit 2 A．TextDM74LSl38·DM74LSl39Decoder／DemuhiplexerB．ReadingAnalog Chip C．Extracurricular KnowledgeCortex Chip Goes Both WaysUnit 3 A．TextLow-Power，8-Channel，Serial10．Bit ADCPseudo-Differential InputTrack／HoldB．ReadingAnalog／Digital Converter TechnologyDevelopment TrendsC．Extracurricular KnowledgeA／D Converters，the Comparisonand ClassificationChapter Ⅲ TechnologyUnit 1 A．TextIon Implantation Processes in Semiconductor Manufacturing Monte．Carlo Method for Simulation of Ion ImplantationB．ReadingWet Etching of Silicon DioxideC．Extracurricular Knowledge SiGe TechnologyUnit 2 A．TextThermal OxidafonB．ReadingSingle Crystal Growing for WaferProductionC．Extracurricular KnowledgeTestTest LinksChapter IV Encapsulation &TestingUnit 1 A．TextAssembly and Packaging B．ReadingSome Different Kinds of PackageTechniqueC．Extracurricular KnowledgePackaging For SpecializedFunctions Unit 2 A．TextAdvanced Packaging ElementsB．ReadingThe Equipment of Assembly andPackagingC．Extracurricular KnowledgeDesignInterconnect RF／AMS WirelessEnvironment．Safety&HealthModeling& SimulationTestOther ExpressionsChapter V EquipmentUnit 1 A．TextSemiconductor Wafer FabricationEquipmentEpitaxial ReactorsOxidation SystemsDiffusion Systems Ion Implantation EquipmentPhysical Vapor DepositionSystemsChemical Vapor DepositionSystemsPhotolithography EquipmentEtching EquipmentB．ReadingThe LPCVD ModelDevelopmentC．Extracurricular KnowledgeOptical Proximity CorrectionUnit 2 A．TextSemiconductor Packaging／AssemblyEquipmentB．ReadingScheduling Semiconductor WaferFabricationC．Extracurricular KnowledgeUnit 3 A．TextCMP EquipmentB．ReadingSurface．Mount TechnologyC．Extracurricular KnowledgeCMP ProcessUnit 4 A．Text．Basic Structure of IonImplanter Ion Implanter Types*B．ReadingIon Implanter ConceptsC．Extracurricular KnowledgeHigh Current Implanter 200keVSeries 1090 Technical DescriptionChapterⅥ Business WritingUnit 1A．FextFhesis AbstractB．ReadingAbstractC．Extracurricular Knowledge Defining the Research PaperUnit 2A． TextHow to Write a Resume& CoverLetter B．ReadingHow to Write Resume inEnglishC．Extracurricular Knowledge Appendix 部分参考译文及练习答案**章 历史**单元A．课文仙童公司的**只晶体管B．阅读第二单元A．课文逻辑电路的历史B．阅读第三单元A．课文Wanlass的收获B．阅读第二章 芯片**单元A．课文LM741运算放大器B．阅读第二单元A．课文DM74LSl38·DM74LSl39译码器／多路输出选择器B．阅读．第三单元A．课文低功耗、8通道、串行10位ADC．伪差分输入采样／保持B．阅读第三章 工艺**单元A．课文半导体制造过程中的离子注入工艺蒙特卡罗法模拟离子注入B．阅读第二单元A．课文热氧化B．阅读第四章 封装与测试**单元A．课文组装与封装B．阅读第二单元A．课文先进的封装因素B．阅读第五章 设备**单元A．课文半导体晶圆制造设备外延反应设备氧化系统扩散系统离子注入系统物理气相淀积系统化学气相淀积系统光刻设备刻蚀设备B．阅读第二单元A．课文半导体封装设备B．阅读第三单元A．课文化学机械平坦化设备B．阅读第四单元A．课文离子注入机的基本结构离子注人机类型B．阅读第六章 应用文**单元A．课文论文摘要B．阅读第二单元A．课文如何撰写简历及自荐信B．阅读参考文献

微电子专业英语 节选

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