3.11钎焊方法和工艺Methods and Technology of Soldering and Brazing144
3.11.1铜Copper144
3.11.2黄铜Brasses144
3.11.3铜和黄铜软钎焊接头强度The Strength of Copper and Brass Soldered Joints144
3.11.4锰黄铜Manganese Brasses147
3.11.5铍铜Beryllium Copper148
3.11.6铬铜Chromium Copper148
3.11.7镉铜和锡青铜Cadmium Copper and Tin Bronzes148
3.11.8硅青铜Silicon Bronzes148
3.11.9铝青铜Aluminum Bronzes148
3.11.10锌白铜和锰白铜Copper-nickel Alloys149
参考文献References149
第4章电子工业中的软钎焊Chapter 4 Soldering in Electronic Industry151
4.1电子制造与软钎焊Electronic Manufacture and Soldering151
4.1.1软钎焊在电子工业中的地位The Position of Soldering Technique in Electronic Industry151
4.1.2电子制造与电子封装Electronic Manufacture and Electronic Packaging151
4.1.3电子工业中钎焊连接的特点及发展历程The Characteristic and Development Course of Soldering Technique in Electronic Industry152
4.2软钎焊连接的基本原理Fundamental of Soldering154
4.2.1软钎焊的定义Definition of Soldering154
4.2.2钎料与母材间的相互作用Interaction Between Solder and Base

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