1.5.3 布线跟随模式 ····························································································（7）
1.6 Draftsman 功能的改进 ···························································································（8） 1.7 无限制地增加机械层·····························································································（8） 1.8 微孔的设计·········································································································（9） 1.9 元器件的回溯功能································································································（9） 1.10 多板的 PCB 设计 ······························································································（10） 1.10.1 多板设计 2.0 的特点·················································································（10） 1.10.2 具体操作方法·························································································（10）

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