微机电器件设计.制造及计算机辅助设计 内容简介

Thisbookfirstlyintroducesthepertinentfundamentaltheory，importantmaterialandfabricationprocessofmicroＧelectromechanicalsystems．Basedonthesetheories，thedesignruleandimportantengineeringexamplesaredescribedindetail．Then，manyengineeringapplicationsforMEMSincludingtheaccelerationmeasurement，theangularspeedmeasurementandthepressuremeasurementareintroduced．Finally，finiteelementmethodisintroducedinordertoprovethecorrectnessofthedesign．Thisengineeringapplicationofsimulationincludesthestaticandmodalanalysisofthebeam，capacitanceanalysis，thermalＧstructureanalysisofthedeviceandfatigueanalysisetc．Itcanbeselectedasthereferencetothepostgraduates，undergraduatesandpertinentengineeringstaffwhoseresearch directionsareinstrumentationscienceandtechnology，controlscienceandengineering，mechanicalengineeringetc．

微机电器件设计.制造及计算机辅助设计 目录

Chapter1　Introduction ………………………………………………………………………… 1
1．1　ConceptofMEMS ……………………………………………………………………… 1
1．2　DevelopmentofMEMS ………………………………………………………………… 4
1．3　MEMSCAD …………………………………………………………………………… 9
Chapter2　BasictheoryofMEMS …………………………………………………………… 12
2．1　TheoryofelectrostaticMEMScombactuators …………………………………… 12
2．1．1　Introduction ……………………………………………………………………… 12
2．1．2　Operatingprinciples …………………………………………………………… 13
2．1．3　Platecapacitortheoryinidealcondition ……………………………………… 14
2．1．4　ThemodifiedmodelofMEMSplatecapaciator ……………………………… 17
2．1．5　Calculationofelectrostaticcombdrivingforceinidealsituation …………… 24
2．1．6　Weakcapacitancedetectionmethodofelectrostaticcombdrive …………… 26
2．2　RelevanttheoreticalcalculationsfortheMEMScantileverbeam ………………… 34
2．2．1　Introduction ……………………………………………………………………… 34
2．2．2　Theoreticalcalculationmethodforcantileverbeam ………………………… 35
2．2．3　RelevanttheoreticalcalculationofaxialtensileandcompressiveonsingleGend
clampedbeams ………………………………………………………………… 36
2．2．4　RelatedtheoreticalcalculationsofdoubleGendclampedbeamsaxialtension
andcompression ………………………………………………………………… 40
2．3　MembranetheoryofMEMS ………………………………………………………… 47
2．3．1　Theoryofclampedaroundcirculardiaphragm ………………………………… 48
2．3．2　Theoryofclampedaroundrectangularflatdiaphragm ……………………… 49
References …………………………………………………………………………………… 52
Chapter3　MEMSmaterials …………………………………………………………………… 53
3．1　Monocrystallinesilicon ……………………………………………………………… 53
3．1．1　Introduction ……………………………………………………………………… 53
3．1．2　Crystalorientationofmonocrystallinesilicon ………………………………… 55
3．2　Polycrystallinesilicon ………………………………………………………………… 64
3．3　Silica …………………………………………………………………………………… 66
3．4　Piezoelectricmaterials ………………………………………………………………… 67
3．4．1　Piezoelectriceffectandinversepiezoelectriceffectofmaterials …………… 67
3．4．2　Quartzcrystal …………………………………………………………………… 68
3．4．3　Piezoelectricceramics …………………………………………………………… 73
3．5　OtherMEMSmaterials ……………………………………………………………… 75
3．6　Summary ……………………………………………………………………………… 76
Chapter4　MEMStechnology ………………………………………………………………… 77
4．1　MEMSlithographyprocess ………………………………………………………… 78
4．2　KeytechnologyofMEMSlithographyprocess …………………………………… 80
4．2．1　Wafercleaning …………………………………………………………………… 80
4．2．2　Siliconoxidation ………………………………………………………………… 80
4．2．3　Spincoatingprocess …………………………………………………………… 87
4．2．4　Prebaking ………………………………………………………………………… 90

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教材 研究生/本科/专科教材 工学

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